GP2312C8 high-frequency trading server

Ultra high computing power

lSupports 12th/13th/14th generation Intel ®   CoRE   ®   Series processors;

lSupports 2 high-power GPUs; The motherboard has two native M.2 interfaces, which can achieve ultra-high computing power

lUsing DDR5 memory technology, it supports up to 192 memory expansion capabilities; Compared to the previous generation platform, there have been comprehensive improvements in kernel, frequency, cache, and interconnection channels.

Scalability

lSupports 4 7200 MT/s DDR5 DIMM memory types, providing excellent speed, high availability, and 192GB of memory capacity;

lstorage elastic expansion, in addition to 8 built-in 3.5-inch hard drive slots, 2 optional 2.5-inch hard drive slots can also be equipped;

lCPU, memory, storage, PCIe, and other components can be expanded on demand to meet the demands of ultra-high computing power applications such as digital currency, cloud computing, big data, and virtual computing.

Modular design

lBased on the concept of humanized design, by enhancing and optimizing some structural components, rapid disassembly and assembly can be achieved, greatly reducing operation and maintenance time. By combining advanced intelligent temperature control technology with advanced air cooling systems, the entire machine can work in a better environment;

Remote management

lRemote management, where real-time monitoring of the system and real-time operations including power on and off can be carried out remotely;

Central Processing Unit

Single Socket V (LGA-1700)14th/13th/12th Generation Intel® Core ProcessorsSupport CPU TDP 125WUp to 16(8+8) cores

Memory capacity

4 x DIMM slots, Max. 192GB, DDR5 7200 (OC)/7000(OC)/6800(OC)/6600(OC)/6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600/ 5400/ 5200/ 5000/ 4800 Non-ECC,   Un-buffered Memory*Dual Channel Memory ArchitectureSupports Intel® Extreme Memory Profile (XMP)OptiMem II* Supported memory types, data rate (speed), and number of DRAM modules vary depending on the CPU and memory* Non-ECC, un-buffered DDR5 memory supports On-Die ECC function.

Chipset

Intel® Z790 chipset

storage

Total supports 3 x M.2 slots and 4 x SATA 6Gb/s ports

LAN

1 x Realtek 1Gb Ethernet1 RJ45 Dedicated IPMI LAN portWi-Fi 5 Wi-Fi 5 (802.11 a/b/g/n/ac)Supports 2.4/5GHz frequency band Bluetooth v5.0** The Bluetooth version may vary, please refer to the Wi-Fi module manufacturer's website for the latest specifications.

USB

1 x USB 3.2 Gen 2x2 port (1 x USB Type-C®)
1 x USB 3.2 Gen 2 port (1 x Type-A)
2 x USB 3.2 Gen 1 ports (2 x Type-A)
4 x USB 2.0 ports (4 x Type-A)
1 x HDMITM port1 x Wi-Fi Module1 x Realtek 1Gb Ethernet port
3 x Audio jacks1 x PS/2 Keyboard/Mouse combo port

Appearance and morphology

2U Rackmountable with Rail kit

height

88mm

width

432mm

depth

660mm

Disk slot

3.5" Hot-swap：8
Slim ODD：1
Internal 2.5"：2
Interface: 1 PCI-E 4.0 x4
Form Factor: 2280, 22110
Key: M-key

PCI-Express

Intel® 13th & 12th Gen Processors*1 x PCIe 5.0 x16 slot
Intel® Z790 Chipset3 x PCIe 4.0 x16 slots
(support x4 mode)1 x PCIe 3.0 x1 slot

source

1250W Gold Medal Power Tower Full Module

Environmental specifications

Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)